In the reverse-conducting IGBT according to the present invention, an n-type buffer layer surrounds a p-type collector layer. A p-type separation layer surrounds an n-type cathode layer. The n-type buffer layer separates the p-type collector layer and the p-type separation layer from each other. The p-type separation layer separates the n-type cathode layer and the n-type buffer layer from each other. Therefore, the present invention makes it possible to reduce snapback.

An n-type substrate surface and a p+ region are provided adjacent to each other, on upper surfaces of which an insulation film, a shield and a conductor are formed in this order. The shield is connected to the conductor. The shield and the conductor are insulated from the n-type substrate surface by the insulation film. Even when polarization occurs in a mold provided over a semiconductor device due to a potential distribution along the substrate surface of the semiconductor device, the conductive shield can prevent the substrate from being affected by the polarization in the mold, allowing avoidance of an adverse influence of deterioration in breakdown voltage and the like.

A large plastic blow-molded bottle of at least 64 oz., preferably 96 oz. or larger, is provided with an insert-type handle that preferably extends substantially within a maximum circumference of the bottle. The bottle has a height-to-width ratio of less than 2:1. Sufficient moldability is achieved by providing a vertical elongation magnification of approximately 2:1 and a horizontal elongation magnification of at least 3:1. The bottle can be round or rectangular in shape and may include a narrow side dimension (depth) of less than about 120 mm, allowing it to fit within the side pocket shelving of most refrigerators. The bottle may have a maximum total height of 265 mm or less so that it can fit on a standard sized shelf designed for a 64 oz. bottle.

Light from a pattern of a mask；travels through a first imaging optical system K；to form a primary image I of the mask pattern. Light from the primary image I travels through a center aperture of a main mirror M；and a lens component L；to be reflected by a sub-mirror M；and the light reflected by the sub-mirror M；travels through the lens component L；to be reflected by the main mirror M；The light reflected by the main mirror M；travels through the lens component L；and a center aperture of the sub-mirror M；to form a secondary image of the mask pattern at a reduction ratio on a surface of wafer；On this occasion, since a reflective surface R；of the sub-mirror M；is backed with a heat-sink plate；having a larger heat conductivity than the lens component L；, heat generated at the reflective surface R；which is a back reflective surface generating relatively large quantity of heat, becomes easier to escape to the heat-sink plate；rather than to the lens component L；, whereby it becomes feasible to implement imaging with high accuracy.

To provide an optical signal processing device that can collect light from an input waveguide to form a beam array having a small diameter. The optical signal processing device includes input waveguides 302a to 302c, an array waveguide 305 and a slab waveguide 304 that is connected to a first arc 304a having the single point C as a center and input waveguides 302a to 302c and that is connected to a second arc 404b having the single point C as a center and an array waveguide 305.

Alignment is carried out between a mask and a wafer even during exposure as occasion demands, according to the movement of a pattern image caused by the positional fluctuation of a reflecting member. An exposure apparatus includes detection systems (；) and (；) for detecting the fluctuation amounts of reflecting members (M；) and (M；) from a reference position, and an arithmetic system (；) adapted to compute an amount of correction based on the detected fluctuation amounts, the amount of correction regarding at least one of the mask and the photosensitive substrate (；), and being necessary for substantial alignment between the pattern image formed in a moved state from a reference image-forming position and the photosensitive substrate (；). Based on the computed amount of correction, at least one of the mask and the photosensitive substrate is moved.

The formation of large-grain poly-silicon films on high-reflective alumina ceramics has been investigated by means of electron beam recrystallization technique. Sample structure is poly-silicon layer/buffer layers (SiN x/SiO x) on alumina ceramic substrate. These layers are deposited by high-rate electron cyclotron resonance plasma chemical vapor deposition method. We have found that the SiO x layers act as a thermal buffer and an impurity contamination barrier against the ceramic, and the SiN x layer has an important role in obtaining good wettability of molten silicon. We have also found that there are optimal thickness of buffer layers, scanning speed, and electron beam power to obtain good quality grains without agglomeration and cracks

The present invention is to provide a photomask which has a sufficient durability to short-wavelength exposure beams, too, and also can prevent any foreign matter from adhering to patterns for transfer. In a photomask on which a transfer pattern to be transferred to an exposure-target substrate；is formed and through which a stated exposure beam applied to a pattern surface 1P where the transfer pattern is formed is guided to a projection optical system PL for forming an image of the pattern, the photomask comprises a transmitting plate；disposed apart from the pattern surface by a stated interval d；and having a stated thickness h and a transmission to the exposure beam, and the transmitting plate is substantially square and fulfills a stated condition.

The technical problem to be solved is to change the thickness of the colored resin layer of the preform gradually in the upward or downward direction, by utilizing a tendency of gradual decrease in the thickness of the colored resin layer caused by the flow of the main resin inside the preform mold when the main resin and the colored resin are injected into the mold. This involves adjusting the injection pattern including the time of starting and ending the supply of the main resin and the colored resin, and pressure or velocity profiles, reducing the thickness of the colored resin layer gradually upstream or downstream, injection-molding the preform in which a color-gradated portion associated with the thickness of the colored resin layer has been formed, and biaxially drawing and blow molding this preform into a bottle having a color-gradated portion.

The technical problem to be solved is to change the thickness of the colored resin layer of the preform gradually in the upward or downward direction, by utilizing a tendency of gradual decrease in the thickness of the colored resin layer caused by the flow of the main resin inside the preform mold when the main resin and the colored resin are injected into the mold. This involves adjusting the injection pattern including the time of starting and ending the supply of the main resin and the colored resin, and pressure or velocity profiles, reducing the thickness of the colored resin layer gradually upstream or downstream, injection-molding the preform in which a color-gradated portion associated with the thickness of the colored resin layer has been formed, and biaxially drawing and blow molding this preform into a bottle having a color-gradated portion.

The technical problem to be solved is to change the thickness of the colored resin layer of the preform gradually in the upward or downward direction, by utilizing a tendency of gradual decrease in the thickness of the colored resin layer caused by the flow of the main resin inside the preform mold when the main resin and the colored resin are injected into the mold. This involves adjusting the injection pattern including the time of starting and ending the supply of the main resin and the colored resin, and pressure or velocity profiles, reducing the thickness of the colored resin layer gradually upstream or downstream, injection-molding the preform in which a color-gradated portion associated with the thickness of the colored resin layer has been formed, and biaxially drawing and blow molding this preform into a bottle having a color-gradated portion.

The blind mutant FN68 of the unicellular flagellate green alga Chlamydomonas reinhardtii is negatively phototactic in the presence of the native chromophore all-trans retinal. In contrast, analog chromophores such as a ring-acyclic retinal and those in which trans/cis isomerization about the C11 dbd C12 double bond was blocked induced predominantly positive phototaxis in the same strain under the same experimental conditions. These observations can be interpreted by assuming that the negative and the positive phototaxis is mediated distinctively by two rhodopsin species which differ in their affinities with the exogenous chromophores. However, a more reasonable explanation, which requires fewer assumptions, is that the sign of phototaxis depends on a delay in intracellular photosignal transduction. This novel view was deduced directly from the widely accepted hypothesis (1980, Microbiol. Rev. 44, 572-630) on phototaxis mechanisms.