SELECTIVE PLATING DEVICE AND SELECTIVE PLATING DIE THEREOF

Abstract(summary):

A selective plating device (1) and a selective plating die (30) thereof. The selective plating die (30) comprises a roller-shaped die body (31). Plating holes (310) are formed in the roller-shaped die body (31). The selective plating die (30) also comprises a linkage mechanism connected to the die body (31), and the linkage mechanism is used for linking the die body (31) with a drive mechanism (20), so that the die body (31) can rotate around the center axis of the die body along with the drive mechanism (20). Because the selective plating die (30) is provided with the linkage mechanism connected to the drive mechanism (20), the selective plating die (30) can actively rotate under the drive of the drive mechanism (20), the plating efficiency can be improved, the defect-free rate in plating is improved, the service life of the die is prolonged, and an adjustment process of the plating die is simplified.