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COMPRESSION RING AND SEMICONDUCTOR PROCESSING EQUIPMENT

Abstract(summary):

Disclosed are a compression ring and a semiconductor processing equipment. The compression ring comprises a compression ring body (11, 21) on the inner ring wall of which a plurality of fixing portions (121) and a plurality of shielding portions (122) are provided at intervals in circumferential direction thereof, wherein a plurality of the fixing portions (121) and a plurality of the shielding portions (122) are arranged alternately, the fixing portions (121) serving to compress a first edge area of the upper surface of a wafer (13, 24) and the shielding portions (122) serving to shield a second edge area of the upper surface of the wafer (13, 24). The above-described compassion ring can solve the problem that metal plating coating is deposition on the side or back side of the wafer (13, 24), so that the process results can be improved.


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