Scalable 3D dense integration of photonics on bulk silicon

Author:

Sherwood-Droz, Nicolás   Lipson, Michal  

Journal:

oe/19/18/oe-19-18-17758.pdf

Issue Date:

2011

Abstract(summary):

We experimentally show vertically stacked, multi-layer, low-temperature deposited photonics for integration on processed microelectronics. Waveguides, microrings, and crossings are fabricated out of 400degreesC PECVD Si3N4 and SiO2 in a two layer configuration. Waveguide losses of ~1 dB/cm in the L-band are demonstrated using standard processing and without post-deposition annealing, along with vertically separated intersections showing -0.04 0.002 dB/cross. Finally 3D drop rings are shown with 25 GHz channels and 24 dB extinction ratio.