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Immersion Cooling of Electronics Utilizing Lotus-Type Porous Copper

Author:
Yuki, Kazuhisa   Hara, Tomohiro   Ikezawa, Soichiro   Anju, Kentaro   Suzuki, Koichi   Ogushi, Tetsuro   Ide, Takuya   Murakami, Masaaki   


Journal:
Transactions of The Japan Institute of Electronics Packaging


Issue Date:
2016


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