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[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 2 - Double-Sided Microchannel Cooling of a Power Electronics Module Using Power Overlay

Author:
Pautsch, Adam G.   Gowda, Arun   Stevanovic, Ljubisa   Beaupre, Rich   


Issue Date:
2009


Page:
427-436


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