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Flip-chip optical couplers with scalable I/O count for silicon photonics

Author:
Soganci, Ibrahim Murat   La Porta, Antonio   Offrein, Bert Jan  


Journal:
Optics Express


Issue Date:
2013


Abstract(summary):

A scalable and tolerant optical interfacing method based on flip-chip bonding is developed for silicon photonics packaging. Bidirectional optical couplers between multiple silicon-on-insulator waveguides and single-mode polymer waveguides are designed and fabricated. Successful operation is verified experimentally in the 1530-1570 nm spectral window. At the wavelength of 1570 nm, the coupling loss is as low as 0.8 dB for both polarization states and the planar misalignment loss is less than 0.6 dB for TE and 0.3 dB for TM polarization in a lateral silicon-polymer waveguide offset range of +/- 2 mu m. The coupling loss does not exhibit any temperature dependence up to the highest measurement point of 70 degrees C. (C)2013 Optical Society of America


Page:
16075


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