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Immersion cooling nucleate boiling of high power computer chips

Author:
Mohamed S. El-Genk  


Journal:
Energy Conversion and Management


Issue Date:
2012


Abstract(summary):

This paper presents experimental results of saturation and subcooled boiling of FC-72 and HFE-7100 dielectric liquids on uniformly heated, 10times10mm porous graphite (PG) surfaces for potential applications to immersion cooling of high power computer chips. The experiments investigated the effects of surface inclination, from upward-facing (0deg) to downward-facing (180deg), and liquid subcooling from 0 to 30K on nucleate boiling heat transfer coefficient and critical heat flux. The presented experimental data and correlations for natural convection of dielectric liquids on PG and plane surfaces are important for cooling chips while in the standby mode when surface heat flux <20kW/m 2. The experimental curves of the nucleate boiling heat transfer coefficient for FC-72 dielectric liquid in the upward-facing orientation are used in 3-D thermal analysis for sizing and quantifying the performance of copper (Cu), PG and PG-Cu composite spreaders for removing the dissipated thermal power by an underlying 10times10mm computer chip with non-uniform heat dissipation. The 2mm-thick spreaders are cooled by either saturation or 30K subcooled nucleate boiling of FC-72 and the composite spreader consists of 0.4mm-thick surface layer of PG and 1.6mm-thick Cu substrate. [All rights reserved Elsevier].


Page:
205-218


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