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Reactive ion etching for the production of metal microstructures by hot embossing

Author:
O. Roetting   M. Heckele   W. Bacher  


Journal:
Microsystem Technologies


Issue Date:
1999


Abstract(summary):

A reactive ion etching process which has been developed in order to remove the residual polymer layer, that remains at the bottom of microstructures made by hot embossing, is described. The influence of parameters and structures is explained


Page:
11-14


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