IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A
Issue Date:
1997
Abstract(summary):
This paper describes a novel packaging technology for high power multichip modules (MCM's). The work covers three areas: The fabrication of a multichip module which provides access to the die backside for heat removal, the development of high performance microchannel heat sinks with a matched CTE, as well as a low thermal resistivity assembling technology. The MCM is fabricated bg means of the planar embedding technology. By planarizing the module backside a low thermal resistance between heat sink and dice tan be accomplished simultaneously for all embedded components. A thermotest module of size 2 x 2 in capable of power dissipation of several hundred Watts was fabricated, Thermal resistance values below 0.6 Kcm(2)/W at 50 W/cm(2) chip flux have been achieved.