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High power multichip modules employing the planar embedding technique and microchannel water heat sinks

Author:
Hahn, R  Kamp, A  Ginolas, A  Schmidt, M  Wolf, J  Glaw, V  Topper, M  Ehrmann, O  Reichl, H  


Journal:
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A


Issue Date:
1997


Abstract(summary):

This paper describes a novel packaging technology for high power multichip modules (MCM's). The work covers three areas: The fabrication of a multichip module which provides access to the die backside for heat removal, the development of high performance microchannel heat sinks with a matched CTE, as well as a low thermal resistivity assembling technology. The MCM is fabricated bg means of the planar embedding technology. By planarizing the module backside a low thermal resistance between heat sink and dice tan be accomplished simultaneously for all embedded components. A thermotest module of size 2 x 2 in capable of power dissipation of several hundred Watts was fabricated, Thermal resistance values below 0.6 Kcm(2)/W at 50 W/cm(2) chip flux have been achieved.


Page:
432---441


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