Creat membership Creat membership
Sign in

Forgot password?

Confirm
  • Forgot password?
    Sign Up
  • Confirm
    Sign In
Creat membership Creat membership
Sign in

Forgot password?

Confirm
  • Forgot password?
    Sign Up
  • Confirm
    Sign In
Collection
For ¥0.57 per day, unlimited downloads CREATE MEMBERSHIP Download

toTop

If you have any feedback, Please follow the official account to submit feedback.

Turn on your phone and scan

home > search >

Multi-layer atom chips for atom tunneling experiments near the chip surface

Author:
Chuang, Ho-Chiao  Salim, Evan A.  Vuletic, Vladan  Anderson, Dana Z.  Bright, Victor M.  


Journal:
SENSORS AND ACTUATORS A-PHYSICAL


Issue Date:
2011


Abstract(summary):

This paper describes the design and fabrication of an atom chip to be used in ultra-high-vacuum cells for cold-atom tunneling experiments. A fabrication process was developed to pattern micrometer- and nanometer-scale copper wires onto a single chip. The wires, with fabricated widths down to 200 nm, can sustain current densities of more than 7.5 x 10(7) A/cm(2). Partially suspended wires, developed in order to reduce the Casimir-Polder force between atoms and surface, were also fabricated and tested. Extensive measurements for variable wire width show that the sustainable currents are sufficiently large to allow chip-based atom tunneling experiments. Such chips may allow the realization of an atom transistor. (c) 2010 Elsevier B.V. All rights reserved.


Page:
101---106


VIEW PDF

The preview is over

If you wish to continue, please create your membership or download this.

Create Membership

Similar Literature

Submit Feedback

This function is a member function, members do not limit the number of downloads