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Microstructure investigation of Sn‐0.5Cu‐3.5Ag and Sn‐3.5Ag‐0.5Cu‐0.5B lead‐free solders

Author:
Ye, L.   Lai, Z.H.   Liu, J.   Th?lén, A.  


Journal:
Soldering & Surface Mount Technology


Issue Date:
2001


Abstract(summary):

This paper identifies the intermetallics formed in Sn-0.5Cu-3.5Ag and Sn3.5Ag-0.5Cu-0.5B (wt%) lead-free solders, and the influence of boron on these precipitates. SEM, TEM and SIMS were used to reveal the difference in microstructure in both solder alloys. It was found that the intermetallics formed were Ag 3Sn and Cu 6Sn 5. Both solders were found to have a dispersion structure of Ag 3Sn particles with network-shaped subgrains. The Ag 3Sn microstructure was also found to become finer and more uniform in Sn3.5Ag-0.5Cu-0.5B solder, due to the addition of boron, while there was little effect from the boron on the Cu 6 Sn 5 phase


Page:
16-20


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